IC Laser Marking System
Products application :
1. Automatic loading/unloading (Slot/Stack magzine), high efficency. 
2. Automatic marking position adjusting by using CCD vision positioning. 
3. SECS-GEM supported.
FPC、PCB Laser Cutting System
Products application :
Suitable for high-precision Laser processing such as FPC/PCB/Finger Module Cutting & Perforating. Manual/Automatic loading & unloading handler optional. Come with customized dust proof & vacuum dust exhausting system.
SIP Laser Cutting System
Products application :
Suitable for SIP packaging,compatible for 2D Barcode Laser marking, Laser grooving, Laser cutting. Manual/Automatic loading & unloading handler optional. Come with customized dust proof & vacuum dust exhausting system.
Plasma Cleaning System
Products application :
1.It is suitable for cleaning products of L/F, Substrate and BGA before W/B and before molding in semiconductor packaging process. 
2.It adopts automatic program control interface and touch screen man-machine interface,and is easy to operate. 
3.With unique cavity design, it has good cleaning uniformity and high cleaning quality.
Wafer Laser Grooving System
Products application :
It is available for  wafer Laser  grooving